SMD Assembly

As an EMS supplier we are specialized in PCB assembly from prototypes to high-volume production – delivering precision, speed, and flexibility.

Advanced SMT Assembly for High-Quality PCB Production

Our PCB assembly solutions cover both conventional and SMT assembly.

Manual assembly is handled by a team of highly skilled professionals, while SMT assembly is performed using state-of-the-art high-precision machines. These integrated automated production lines ensure fast, cost-effective, and high-quality component placement. All processes are conducted in ESD-protected environments. We utilze LEAN production 5S and JIT (just in time) methods.

At the core of our PCB production is our SMD machine park, which includes 4 fully automated, high-precision SMT lines.

Precision PCB SMD Assembly with Automated Processes

Here is our SMT capacity and capabilities:

4 x HighTech SMD lines from the latest generation by JUKI with 4 integrated automats and lead-free ovens for Reflow-soldering by Vitronics and Heller
Max. component placement per hour: 250.000 CPH Acc. IPC9850
Max. component placement per year: 1.25 billion components Acc. IPC9850
The smallest SMD (Surface Mount Device) component size, which is 0.4mm in length and 0.2mm in width, 01005 inch-code
BGA and uBGA
SPI (solder paste inspection) in each SMD line – Koh Young KY8030-3
2-D inspection for paste printing
The smallest SMD (Surface Mount Device) component size, which is 0.4mm in length and 0.2mm in width, 01005 inch-code
Supply and assembly of exotic elements
100 % traceability with automatic labeling– barcode system
Automatic SMD assembly for series production with Reflow-soldering and glue-technology
2 x AOI lines

Heller MK3 1809

12 Zones for heating – up and down
2 Zones with cooling system

Vitronics Soltec MR933

12 Zones for heating – up and down
2 Zones with water cooling

Benefits of SMD Assembly for PCB Manufacturing

In SMT assembly, unlike conventional THT assembly, components are not connected to the back of the circuit board with wire leads. Instead, they are soldered directly onto the PCB via their connection surfaces. The process begins by applying solder paste to the designated solder pads using an SMD stencil.

Eliminating the need for drilled holes for THT components reduces the space required for electronic components, allowing for a denser, double-sided assembly. This space efficiency enables cost reductions and facilitates the faster, more economical production of smaller devices.

SMT components are also smaller than THT components, which allows increasingly complex PCBs to be built within a more compact area. The reduced production time further lowers manufacturing costs. Additionally, the small spacing between components improves high-frequency performance. The absence of wire connections and the use of smaller components also contribute to lighter products.

Furthermore, SMD assembly produces assemblies with a smooth back surface.

With SMD assembly, the soldering process takes place either in a soldering system (vapor phase) or in a reflow soldering oven. Reflow soldering is typically used for top-side assembly, while wave soldering is preferred for bottom side.
Manual assembly is uncommon with SMD and is generally only used for sample production.

Given the small size of the components, the soldering process is monitored using advanced image processing systems such as AOI (Automatic Optical Inspection), SPI (Solder Paste Inspection), and AXI (Automatic PCB X-Ray Inspection). Automatic optical inspection of testable points requires a higher standard of manufacturing quality.

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